3dnow!
alu
agu
bga
bht
bpu
brach pediction
cmos: complementary metal oxide3 百度竞价推广iconductor，互补金属氧化物半导体
cisc
clk
cob
cod
cpga
cpu
data forwarding
decode
dib
ec
embedded chips
epic
fadd
fcpga
fp
femms：fast entry/exit multimedia4 state，迅速进入/退出多媒体状况
fft
fid
fifo
flip-chip
flop
fmul
fpu
fsub
gvpp
hl-pbga: 表面黏著，高耐热、轻薄型塑胶球状矩阵封装
ia
icu
id：identify，辨别号码
idf
ieu
imm: intel mobile module6， 英特尔移动模块
instructions cache，指令缓存
instruction coloring
ipc
isa
kni
latency
ldt
local interconnect
mesi
mmx
mmu
mflops
mhz
mp
mps
msrs
naoc
ni：non－intel，非英特尔
olga
ooo
pga: pin-grid array，耗电大
post-risc
pr
psn
pib
ppga
pqfp
raw
register contention
register pressure
register renaming
remark
resource contention
retirement
risc
sec: single edge connector，单边连接器
shallow-trench isolation
simd
sio2f
smi
smm
smp
soi: silicon-on-insulator，绝缘体硅片
sonc
spec
sqrt
sse
superscalar
tcp: tape carrier package，发热小
throughput
tlb
uswc
valu
vliw
vpu
vpu
相关文章推荐
